Products includes conduction cooled, air over conduction cooled and liquid cooled solutions for applications requiring 1-slot to 18-slots. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. or 1. Designed to meet the requirements of VITA 62 for use in harsh environments. Learn more about this product below » Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. The internal SATA SSD memory modules combine the convenience of high-capacity off-the-shelf storage with the reliability of solid-state non-volatile memory. 5, and Vulkan 1. 0 specification. VPX is an ANSI standard that facilitates efficient upgrade to switched fabric technology for the sizeable existing base of VMEbus users, bringing them up to the task of supporting multiprocessing systems that demand the fastest possible communication capabilities. True 6 Channel supply provides full Open VPX support. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. This enables the VX305H-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. AoC3U-210: air over conduction cooled 2 slot 3U VPX ATR chassis for 3U VPX and SOSA aligned plug in card payloads. 5th Generation Intel® Core™ i7 (Broadwell-H) Processor-Based Conduction- or Air-Cooled 3U VPX-REDI SBC with SecureCOTS™ The XPedite7572 single board computer is an optimal choice for computationally-heavy applications requiring maximum data and information protection. . 40GbE. The XChange3012 is a conduction- or air-cooled 3U VPX module that provides both PCI Express and Ethernet switches. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. Conduction cooled at card edge (Air Flow Through or Air Flow Over available) Conformal coating on PWB; 3U VPX. Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. The VPX3-663 combines a PCIe Gen 3. XMC Adapter for 3U OpenVPX This electronics assembly can be damaged by ESD. Air-cooled models include an additional 10/100/1000Base-T port available on the front panel RJ45 connector. The RFDC is a 1 inch pitch, conduction cooled, VPX circuit card assembly per VITA 48. The system leverages LCR’s 600 Series AoC3U-620 chassis for VITA 48. Visit Product page. pitch air-cooled VPX (VITA 48. 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power. Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. The . 3V, 5V, +12V_Aux,ANSI/VITA 48. The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. 8 in. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40 0 C to +85 0 C at the wedge lock edge. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Alignment keying headers provided for extender and plug-in card. A Tour of VITA AFT Cooling Standards in 2023 For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches. The logic-optimized FPGA is well-suited. Conforms to VITA 46 VPX specifications. 3 V. TR E8x/msd-RCx – Rugged 3U VPX Processor. Higher conduction means lower component temperatures . Conduction- or Air-Cooled 3U VPX-REDI XMC/PMC Carrier Card. 1connectors not included 119EXT6024-06XXR 6U VPX Extender 6U - P0 utility, P1, P3 to P6 differential, P2 single ended 119EXT6024-05XXR 6U VPX Extender 6U - P0 utility, P1 to P6 differentialIt includes the complete connector complement under the standard thus enabling streamlined testing of target payloads. 3U conduction-cooled VPX Ethernet router. The liquid-cooled chassis sidewalls will. It is available in commercial air-cooled and ruggedised versions up to and including conduction cooling. The XPand1010 hosts up to two 6U VPX conduction-cooled cards, providing fabric interconnect between the two slots, as well easy access to Gigabit Ethernet, SATA, USB, DVI, and serial port I/O from one or both of the installed 6U VPX SBCs. 88 in. VITA 91 high-density connectors allow for a completely switched backplane. VPX6860: 6U AcroExpress OpenVPX SBC Air or Conduction-Cooled Features & Benefits. 3 slot apertures for a variety of RF and optical I/O connectors targeting a range of applications. Frame has injector/ejector latches for plug-in card. Power and reset LEDs are provided for system status. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. Conduction-cooled 71°C: Conduction-cooled. Conduction-cooled VPX enclosures with liquid assist. 3U Switch. Rugged Design Kit for development of 3U conduction-cooled VPX single board<br /> computers. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. 0. Rugged, Conduction or Air cooled, 3U Dual Core 8640/41D PowerPC for VPX. The 7-slot air-cooled Chassis and Backplane incorporates slots for up to four conduction-cooled 3U VPX Payload Boards, plus a 100GbE Switch, SBC, and VITA 62 power supply, delivering up to 700W. Fax: (604) 875-5867. Product Features. VX3800 is a 3U VPX carrier designed to support any standard XMC/PMC mezzanine and expand I/O flexibility to VPX systems. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. VPX (Virtual Path Cross-Connect), also known as VITA 46, is a set of standards for connecting components of a computer. 52 in. Form Factor: 3U VPX. • Rugged VPX systems where thermal performance is a concern • Options for second level maintenance APPLICATIONS • Meets VITA 48. pitch conduction-cooled VPX (VITA 48. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. 85°C (derating above 60°C) Size: 3U, 0. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. 1000BaseT. For all rugged environments: Air, Land, and Sea. . This dual-port Ethernet XMC card is designed and tested to VITA 47 environmental standards for air-cooled or VITA 20. VITA 48. FREMONT, Calif. 4. NXP (formerly Freescale) QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX Single Board Computer (SBC) The XPedite5970 provides a rugged, feature-rich processing solution that maximizes the performance-per-watt capabilities of a Power Architecture®-based processor module. VITA. Form Factor. 4mm; Weight: To be Announced;Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI. The logic-optimized FPGA is well. The development systems use Concurrent Technologies' commercial off the shelf boards which are also available as rugged conduction cooled, VPX-REDI boards ensuring that applications which are produced on the development Systems can be easily progressed to a ruggedized implementation. Form Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. Up to. Product Type: Backplane; Number of Slots: 5; Rack Height: 3 U; Backplane Type: VPX Full-mesh;The power density of many VPX systems today precludes use of standard conduction-cooled cards. VPX Test Extender 3U 240mm for conduction cooled boards in conduction cooled chassis. 8 standard looks to reduce the dependence on conduction cooling for 3U and 6U circuit cards with VPX connectors. 8 in. 59"L x 4. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. Ports: OpenVPX 3U Switch slot profile: SLT3-SWH-2F24U-14. Also available: 3U VPX HOST SIDE Bus Extention Adapter PCIe Gen. Up to 32GB of high-speed. 0 in. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. or 1. Conduction cooling is defined as the transfer of heat through solids. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. It operates as an all-in-one solution for video capture, process, encode, decode, stream, and display. VPX-TF3090 3U VPX conduction cooled test frame with tBP-VPX3000. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. VPX7652. PUMA 2509 is an industry standard VITA 62 conduction cooled through wedgelock, VPX power supply. Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 40 Gigabit Ethernet, and SecureCOTS™. The XPand1205 is a low-cost, flexible development platform, supporting up to eight 0. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of. View. 2) where keying as defined in the VME64 Extensions standard cannot be applied. 300-400 Watts Pluggable VPX PSU. • Supports 6U VME, cPCI, and VPX modules at 0. Signal rate: 3. The AcroExpress® VPX6860 is a high performance 6U OpenVPX™ single board computer based on the 6th Generation Intel® Xeon® E processor (formerly Skylake) and PCH. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O. Power Supplies. 3A/37A (normal/peak inrush current)performance leaps relative to VME and early VPX systems of just a few years ago. 14 Slot VPX Conduction-Cooled System with Air Assist. 2 mechanicalformat. With Calmark Card Loks and Birtcher Wedge Loks. 3U Switch. It is designed for use in deployed industrial and military applications in harsh environments. As part of our AoC, air over conduction cooled ATR line, the 810 is designed to maintain safe operating temperatures for high power 3U VPX and SOSA. 3U VPX Board - 1 x8, 2 x4, 4 x2 PCIe. 2 conduction cooled modules because of their established deployment track record. Form Factor: VPX Size: 3U. XMC slot. 2) modules. Hartmann Electronic power supplies are designed for extreme environmental and demanding electrical conditions for various applications which are based on PICMG 2. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. 3 V @ 9 mA to 60 mA) Conduction Cooled: MMCX Jack (+3. MIL-STD-704F compliant except 50mSec holdup provided by separate module. The logic-optimized FPGA is well-suited for a. 8 in. View. 's 6U VPX Load Board in a conduction-cooledformat is designed per the IEEE standard 1101. 8 in. blank = mSATA available in Air Cooled configuration*, /C3 = mSATA cutouts 4399-00 (only required when CC1 cooling option selected) XMC Connector Type: t: blank = XMC (VITA 42) Connectors , /X2 = XMC2 (VITA 61) Connectors: Note * - mSATA sockets are always available unless ordering a conduction cooled (CC1) board. 3U VPX carrier card. It supports 3rd Gen Intel Core series processor and Intel QM77 chipset. 85" pitch ver-sion allows for the top and bottom coversDesigned specifically for high-powered, conduction-cooled modules, the AVRO-2 is a compact solution in a 2-slot 3U VPX chassis. The modules can be easily tailored to suit individual requirements, VPX Test Adapter. 84 W Weight Conduction cooled: 535. See full list on xes-inc. PWB area and improved thermal management (air-cooled, conduc-tion-cooled, liquid flow-through cooling), enabling increased func-tional density and providing support for use as an LRM. Aisle Containment. With dual PowerPC e600 cores running at up to 1. Rugged 3U VPX graphics & GPGPU card based on the NVIDIA Turing architecture using the NVIDIA Quadro RTX 5000 GPU with single-link DVI and DisplayPort™++ outputs. 6U, 1 inch pitch form factor. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. VStream-VPX Datasheet Order Enquiry for VStream-VPX. NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX SBC. 2) VPX router serves as an. wedgelocks are utilized to secure conduction-cooled pcb modules in deployed system level, embedded electronics enclosures. 115 Watts Primary or Secondary Side wedgelocks. Cisco ESR6300 with two routed, four switched Gigabit Ethernet interfaces. Accessories. The XPand1205 is a low-cost, flexible development platform, supporting up to eight 0. VITA 48. Up to 20 CFM of airflow is provided per slot. Expansion Plane. or 1. LCR Embedded Systems. Mechanical frame supports 3U, 160mm plug-in card. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. 8 in. Features. 6 Gigabit Ethernet Control Plane on VPX VITA 46. ca. Each DCM has 3Commercial Air-Cooled. The chassis can accept a front and a Rear Transition Module (RTM). LCR’s product line of rugged ATR chassis and integrated systems offer VPX packaging solutions for applications requiring 1-slot to 18-slots. Up to 32GB DDR4 ECC RAM. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. The IC-INT-VPX3e is a powerful OpenVPX 3U Single Board Computer (SBC) based on the Broadwell-DE processor – 14nm High Performance Chip of Intel’s Low Power Spectrum. The Condor GR4-RTX3000 is a rugged 3U VPX form factor card based on NVIDIA® Turing™ architecture and the NVIDIA RTX™ platform. • Board-Level: 3U VPX Router/Switch and 3U VPX DC/DC Converter (VITA 46/48/62/65) Mechanical: 3-Slot Conduction Cooled 3U VPX Chassis, ARINC 404A Tray Mount / Flange Mount PORT CONFIGURATIONS • 20 Ports: 20x 1000BaseT Copper Gigabit Ethernet (1000Mbps per Port) • Special Order Options: - 16x 1000BaseT Copper GigE + 4x. Desk-top chassis for 6U VPX cards (WxDxH: 350x435x593mm) For five front cards and RTMs with a card width of up to 1. 0 specification. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2 EN55022:2010 Equipment ClassB. This platform supports up to eight 0. Continuous 580W output over temperature range of-40C to +85C. Load sharing circuitry for up to 4 modules. The heat from the internal conduction-cooled modules is conducted to sidewall exchangers, where it is dissipated to the ambient environment by forced-air cooling. Conduction cooled version: -40°C to +75°C at wedge locks (+85°C optional) Air cooled version: -40°C to +75°C Storage Temp. Most VPX systems use VITA 48. 3U Open VPX power supply Conduction cooled I 2 C IPMI 46. Verifies chassis can meet power requirement and specifications for VPX. Go-No-Go indicators for 12V, 3. Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. The chassis can accept a front and a rear module. The VPX Timing Clock offers a complete solution set for all PNT needs. 3U OpenVPX™ form-factor (VITA65) Xilinx Kintex-7 325T/410Tuser-programmable FPGA. View product. Select one of the products below to see specifications and learn more. We offer air & conduction cooled power supply units for wide range AC as well as DC input. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). See the Rugged section for more details. The standard configuration includes two 10/100/1000BASE-T Ethernet ports, seven. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. Systems based on ANSI/VITA 48. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. Higher conduction means lower component temperatures . Single-slot 6U VPX form factor Dimensions: 233 mm x 160 mm x 25. comThe VTX994 is a single slot 6U VPX chassis for board bring-up and testing of conduction cooled 6U VPX modules. 11. LOWER RISK. 2 -40°C to 85°C (Rugged Conduction Cooled)Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. 8" conduction cooled VPX power supplies, built to satisfy the most challenging application requirements while providing up. Conduction-cooled, rugged 3U VPX form factor. The Rise of VPX Cooling Requirements VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal management. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. -No. 8 in. Elma Bustronic Corp. The removable storage canisters can be optimized for client operations. Compare Products. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. Conforms to VITA 46 VPX specifications. SolidWedge™. 2. 0 in. Conduction Yes 12 TB 5 GB/s Yes Host Based Yes 7x PCIe Gen3 x4/x8 If used with StoreEngine. 3U and 6U VPX mass storage module using the latest NVMe and SATA SSDs. Acromag VPX products are designed for COTS applications. Features include: conduction cooling, 1" pitch, nternal EMI filters, I2C. It is designed to maintain power to critical systems during short interruptions or voltage fluctuations in the main power source. Data Plane. pitch conduction-cooled CompactPCI modules. 8 Air Flow Through Cooling; Powerful push-pull cooling of front cards. 15g. The LoC-600 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VITA 48. • VITA 46 3U VPX available in conduction cooled -40-+85C environments as well as harsh vibration profiles DESCRIPTION FEATURES & BENEFITS 3U 10G VPX ETHERNET SWITCH AMPHENOL FAMILY OF RUGGEDIZED ETHERNET SWITCHES AAO Part Number Cooling Method Backplane Top AAO RTM Part Number AAO RTM Part. This powerful 6 or 8-core processing module is dedicated to mil-aero edge-computing applications, where performance, efficiency and power management are required. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Abaco’s SBC3612D rugged 3U VPX single board computer delivers the highest performance you can get in a 3U Intel® base. 2 Conduction. Length: 160 mm. PXI Express Chassis Systems. VPX carrier cards provide a simple and cost-effective solution for interfacing mezzanine I/O modules to a VPX computer system. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. Categories:. Data Plane. Input: 80 to 264V AC. 11-1019958-x4 = Conduction cooled version 47915 Westinghouse Drive, Fremont, CA 94539 phone 510-657-4444 fax 510-657-3274 [email protected]″ form factor. Conduction or air cooling. Block Diagram. Ordering Information: Dawn P/N 11-1017632-01. air cooled, conduction cooled, liquid cooled and spray cooled boards. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. StoreEngine is designed to work as a standalone single slot storage device with. Operating Temperature: -40C to +85C. Since heat energy wants to move from. Removable drive modules rated for 100,000 mating cycles. 5"L x 5. Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX™ compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. Standard heatframe components provided represent a high<br /> performance Thermo-Mechanical design, and reduces engineering and<br /> fabrication costs associated with customization. Accessories. Fast backplane replacement makes. Serial I/O. This system. XIt1085 (90040045) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. Technical Specs Accessories Documentation Block Diagram The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. Frame has injector/ejector latches for plug-in card. Related products. Environment: Extended Temperature, Extended shock & vibration : Height: 10. 8 are already available, such as this 3U VPX COTS system with air-flow-through cooling. LoC3U-510 Extends System Cooling Capacity. 0 in. 10 RTM slots for accessing I/O from the corresponding 3U VPX modules installed in the XPand6200 Series. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module The XPand1202 provides a low-cost, flexible, VITA 67 development platform. 10 Rear transition module on VPX VITA 46. Conduction cooled or air cooled; Conformal coating; RoHS or leaded soldering; SWaP (Size, Weight, and Power) Long-term product availability and support;. 0 and VITA 65 connector interoperability. 2, which is compatible with existing enclosures. 3"H Chassis Cooling: Conduction-Cooled Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O 1 * Kintex® UltraScale™ FPGA. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. The XPand1007 system is a low-cost development platform for conduction-cooled 3U VPX cards. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. The XPedite6101 provides a compact and cost-effective rugged computing solution with excellent processing performance-per-watt. (H) Four 0. Fast backplane replacement makes for easy reconfiguration in support of every stage of development. High-Performance 3U VPX Connectivity. 8 in. 2 Advanced Thermal Solutions High speed VPX systems demand advanced solutions to manage hot, power hungry board payloads. January 3rd, 2021. Horizontal air-flow cools over 150W per slot to support state-of-the-art processor boards. 3V auxiliary Parallel operation capable with proprietary wireless. 3U VPX Conduction Cooled Carrier with PCIe Interface and Removable NVMe SSD Module RRT-3UVPX-NVMe-R-C NVMe SSD Connector Removable SSD Slot Module P0 PCIe x4 EP00-EP03 or P1 EP04-EP07 P2 SOSA Aligned Slot Profile: SLT3-PAY-1F1U1S1S1U1U2F1H-14. 2 Type 2, Secondary Side Retainer. It supports up to two 0. Block Diagram. The new single board computer is also differentiated by its advanced cooling architecture for conduction cooled boards. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. DECISIVE PERFORMANCE. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction cooling. DECISIVE PERFORMANCE. pitch air-cooled VPX (VITA 48. The XChange3000 provides easy integration of standard mezzanine cards into modern VPX backplanes. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. A x8 PCI Express 2. 4. ANSI/VITA Stabilized Maintenance. High Performance Embedded Computing. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. MIL-STD 461. WILDSTAR 3XV7 3U OpenVPX FPGA Processor – WB3XV7. VITA 48. 0 standard by specifying additional mechanical details related to the frame construction of conduction-cooled modules. Ethernet Features Built around a non-blocking core fabric, the VPX3-652 supports a wide range of network features, including:Files (3) VPX VITA CARD 3U /. Output over-voltage, over-current, and over-temperature. Available in standard air-cooled and conduction-cooled rugged form factors;The ADC-VPX3-7Z1 is an Open VPX compliant XMC carrier designed to host the Alpha Data ADM-XRC-7Z1 Zynq based mezzanine card. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. System designers therefore have two choices: Either move to VITA REDI alternatives or. 3 V Aux contactus@redrock. 8 in. 2775 Laurel Street Vancouver, BC V5Z 1M9. Grabcad 3U Vita Card. AoC3U-1400 Conduction Cooled Chassis with Air Assist VPX VITA 48. It is available in air. Mercury envisions, creates, and delivers innovative technology solutions purpose-built to meet their customers. FPGA BSP (FBSP) High-Speed Links (HYDRA) Advanced Board Management Controller (aBMC) Highlights. 350 W VITA 62 PSU-Conduction Cooled. pitch conduction. It can. Pictured above (from top counter-clockwise) : Acromag VPX4810 PMC/XMC carrier card in air-cooled, conduction-cooled, and VPX-REDI formats. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of applications across multiple industries. ENHANCE THE PERFORMANCE & RELIABILITY OF YOUR SYSTEM WITH ONE DESIGN DECISION. 30 in. The 3U VPX to PCIe Adapter acts as a PCIe switch, providing an electrically and mechanically optimized interface between PCIe boards and VPX systems. 8-inch and/or 1. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. 5th Generation Intel® Core™ i7 (Broadwell-H) Processor-Based Conduction- or Air-Cooled 3U VPX-REDI SBC with SecureCOTS™ The XPedite7572 single board computer is an optimal choice for computationally-heavy applications requiring maximum data and information protection. Extended temperature options. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. Air (Convection) Cooled – ANSI/VITA 48. SX-153 Dual-Enclave 100/40 Gigabit Ethernet Switch. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. 2) modules. 11/SOSA-aligned and utilizes a Xilinx UltraScale+ ZU5EG MPSoC. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. The VPX base standard defined in VITA 46 is a scalable module and backplane technology designed specifically for high speed, critical embedded systems. DECISIVE PERFORMANCE. One high-speed link on VPX-P1(control plane) Up to twelve high-speed linkson VPX-P1. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. 2 based. Theconduction-cooled VPX load board helps confirm the chassis meets the VITA46/48/65 power specifications for VPX and aids in locating hot spots within theenclosure. The XChange3001 is a 3U VPX-REDI carrier module supporting a single-width XMC card. Description: The XPand1203 is a low-cost, flexible, development platform. It supports up to two 0. Level 4-5 Conduction Cooled 1; Levels 1 through 3 and 5 – Air, Conduction Cooled 1; Rugged 1; View Product Finder 2017, display Page: Maximum Memory. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Convection and conduction-cooled versions available Verifies chassis can meet power requirement and specifica-tions for VPX Aids in locating hot spots in the chassis Go-No-Go indicators for 12V, 3. Item/Part Number: 1940000446-0000R Product Features Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Verifies chassis can meet power requirement and. Table 1 below shows the significant increase in board power consumption over. LXH0000840; Request a Quote. It features a FMC+ slot. This enables the VX305C-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. The open frame concept offers enhanced flexibility, with fast conversion between air and conduction cooled module guides and fast backplane replacement for easy reconfiguration in support of. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. Physical Characteristics. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis.